가능성을 현실로… 어플라이드와 함께하는 사람들 - PSE (Process Support Engineer) 편 — Transcript

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1. 0:03It's so much fun.
2. 0:08Yes. It is a very good job.
3. 0:17Hello. I am in charge of the Achi
4. 0:19Process Support Engineer role. "Process
5. 0:21" refers to the manufacturing process,
6. 0:23and "Support" means dealing directly
7. 0:25with customers.
8. 0:26Hello. I am in charge of the DDP
9. 0:29Process Support Engineer role.
10. 0:31Hello. I am a PDC Process Support
11. 0:34Engineer. The CD SEM I am in charge of
12. 0:37is a system that measures the
13. 0:38dimensions of fine patterns fabricated
14. 0:40through ultra-fine processes by
15. 0:42irradiating a wafer with an electron
16. 0:44beam using a full-powered microscope.
17. 0:47Due to the characteristics of
18. 0:48high-energy electron beams, the CDM
19. 0:50offers high resolution and a deep depth
20. 0:53of field (DOF). Therefore, it can
21. 0:55measure the airflow and width of
22. 0:57patterns with large circulation, as
23. 0:59well as the size of patterns with large
24. 1:01aspect ratios. Simply put, it involves
25. 1:04visualizing the values measured by the
26. 1:06electron beam to verify the pattern's
27. 1:08CD. In fact, it would not be an
28. 1:11exaggeration to say that it is utilized
29. 1:12across the entire semiconductor
30. 1:13manufacturing process. You can think of
31. 1:16it as a process conducted to verify
32. 1:18whether the pattern's CD has emerged
33. 1:21exactly as designed in each process.
34. 1:24Accurately measuring CD is crucial
35. 1:26because failure to meet target
36. 1:28conditions can lead to issues such as
37. 1:31reduced production volume and yield in
38. 1:34subsequent processes. I am
39. 1:36responsible for the etch process.
40. 1:38Applied Etch equipment is a
41. 1:40plasma-based H-etch process system
42. 1:43known as dry etch. I specifically
43. 1:45handle the Simm equipment product line.
44. 1:48The name Simm itself means "symmetry."
45. 1:52It signifies that gas flow, pressure,
46. 1:55RF power, and temperature always
47. 1:57proceed in a "cemently" manner. Its
48. 2:00strength lies in providing
49. 2:02customer-desired solutions by
50. 2:03consistently controlling the wafer
51. 2:05uniformly. Like the value of "Make
52. 2:07Possible Applied," this high standard
53. 2:09of uniformity represents the
54. 2:10differentiated technological prowess
55. 2:12unique to Applied Simm 3 equipment. DDP
56. 2:14is broadly divided into CVD and ALD; I
57. 2:17am responsible for the CVD process. CVD
58. 2:21refers to a process that forms a
59. 2:22protective film on a substrate through
60. 2:24a chemical reaction that decomposes
61. 2:26source gases using external energy,
62. 2:28such as heat or plasma. Applied
63. 2:30Materials currently utilizes three main
64. 2:34CVD processes: PVD, SATVD, and HDP CVD.
65. 2:38First, PCVD is a method of depositing
66. 2:40films by using plasma energy to
67. 2:42decompose raw materials and gases. It
68. 2:44has the advantages of high throughput
69. 2:46and the ability to operate at low power
70. 2:48consumption. On the other hand, SCVD is
71. 2:50a chemical deposition method that
72. 2:52utilizes thermal reactions; while its
73. 2:55throughput is slightly slower than PVD,
74. 2:57it offers the advantage of superior
75. 2:59film quality. HDP CVD is a plasma
76. 3:02process that uses higher-density plasma
77. 3:05than PCVD. By repeatedly performing
78. 3:08edging and deposition, it improves the
79. 3:10gap-fill capability, which is often
80. 3:13cited as a drawback of conventional
81. 3:15PCVD. I work as a mass production line
82. 3:18process engineer. A mass production
83. 3:20line process engineer is responsible
84. 3:22for three main tasks. First, when new
85. 3:24equipment is installed, I set up the
86. 3:26process conditions suitable for that
87. 3:28specific process and adjust various
88. 3:30factors managed by the customer. Once
89. 3:32mass production begins, unexpected
90. 3:34process issues start to arise. We are
91. 3:37responsible for diagnosing the causes,
92. 3:40conducting evaluations, and providing
93. 3:43solutions. In addition, we also conduct
94. 3:46evaluations to improve existing
95. 3:48processes based on customer requests.
96. 3:50To compare the roles, I believe the
97. 3:52primary responsibility of the mass
98. 3:54production line is to resolve current
99. 3:57process issues, identify improved
100. 3:59conditions, and enhance productivity.
101. 4:01Furthermore, we conduct evaluations of
102. 4:03process calculations required for
103. 4:04devices currently in mass production.
104. 4:06On the other hand, the R&D center
105. 4:08focuses more on evaluating equipment
106. 4:10and generating business opportunities
107. 4:12for next-generation devices rather than
108. 4:14those currently in mass production. You
109. 4:16can consider both the R&D center and
110. 4:18the mass production center as
111. 4:19engineering roles focused on finding
112. 4:21process improvement solutions. Our main
113. 4:23task involves considering what items
114. 4:25Applied can actually implement and how
115. 4:28to translate those items into actual
116. 4:30business opportunities. Our
117. 4:32responsibilities can be broadly
118. 4:33categorized into three areas. The first
119. 4:35is the implementation and application
120. 4:37of CP items. This involves implementing
121. 4:40and applying new technology solutions
122. 4:41developed by Applied to client
123. 4:43companies. Through this, we are
124. 4:45striving to continuously improve
125. 4:47process performance. The second role
126. 4:50involves normalizing chronic issues
127. 4:52through tuning. When process targets or
128. 4:54target yields are not met during
129. 4:56semiconductor production, we analyze
130. 4:58the causes and provide improvement
131. 5:00plans. Finally, we provide solutions
132. 5:03for one-off issues. Since semiconductor
133. 5:06equipment consists of various
134. 5:07components, it is often difficult to
135. 5:09pinpoint the cause when a problem
136. 5:11arises. In such situations, we provide
137. 5:13solutions to our clients through
138. 5:15troubleshooting. PSE performs
139. 5:17troubleshooting with the aim of
140. 5:19identifying problems from a process
141. 5:21perspective and making improvements to
142. 5:23achieve better performance. You can
143. 5:27think of it as analyzing based on
144. 5:29process condition requirements and
145. 5:31discovering insights. The knowledge I
146. 5:36gained while working with actual
147. 5:38equipment piece by piece during my CE
148. 5:39role has been of great help in my PSE
149. 5:41duties. For example, while performing
150. 5:44CE work, I was able to better
151. 5:46understand how each hardware component
152. 5:48is configured and interconnected. I
153. 5:51believe that combining this
154. 5:52process-related knowledge with my PS
155. 5:54role allows me to provide better
156. 5:56solutions to our clients. Furthermore,
157. 5:58when equipment issues arise, I find it
158. 6:01much easier to define the problem
159. 6:03because I have the insight to approach
160. 6:06them from a hardware perspective as
161. 6:08well as a process perspective. When I
162. 6:11arrive at the office, I spend the
163. 6:13morning carrying out the day's schedule
164. 6:15or communicating work schedules with
165. 6:17clients regarding upcoming evaluation
166. 6:19rights. Afterward, I proceed with the
167. 6:21scheduled work at the client site. Upon
168. 6:23returning to the office, I organize the
169. 6:26work details and share the evaluation
170. 6:28results I performed with my team
171. 6:30members. If assistance is needed, I
172. 6:33meet with headquarters and wrap up the
173. 6:36day by organizing action items for the
174. 6:38next task. Additionally, to maintain
175. 6:42consistent equipment performance, I
176. 6:44conduct periodic hardware inspections.
177. 6:47As a CD (Design Specialist) who
178. 6:49measures the size of fine patterns, I
179. 6:51match the hardware with reference
180. 6:53equipment after the hardware work to
181. 6:55ensure it meets the specifications
182. 6:57agreed upon with the client.
183. 6:59Collaborating with the hardware team on
184. 7:01equipment matching and flowing the
185. 7:04agreed-upon equipment into the mass
186. 7:06production line makes the day fly by
187. 7:08quickly.
188. 7:10Typically, when long-term issues arise,
189. 7:12I establish various models and conduct
190. 7:15evaluations. I think I felt a great
191. 7:17sense of reward and accomplishment when
192. 7:18process issues were resolved through
193. 7:20the modeling I developed at that time.
194. 7:22I
195. 7:22believe a major advantage is the wide
196. 7:24variety of roles available for taking
197. 7:26on diverse challenges. In the case of
198. 7:28our PDC, there is an R&D Extension
199. 7:30department, and within it, there are
200. 7:32various roles such as the System Team,
201. 7:34Algorithm Development Team, and
202. 7:36Software Team, which is great because
203. 7:38it offers us many opportunities to take
204. 7:41on challenges. Another advantage is
205. 7:44that we can work in a close-knit manner
206. 7:47, sharing data and status across teams,
207. 7:50allowing me to learn a great deal. I
208. 7:54majored in Materials Science and
209. 7:55Engineering for my master's degree. For
210. 7:58my master's research, I fabricated
211. 8:00devices with novel material structures
212. 8:03and analyzed their various physical
213. 8:05properties. In the master's program,
214. 8:08students engage in research activities
215. 8:10where they design efficient
216. 8:12experimental methods for their assigned
217. 8:14topics and analyze the results. Through
218. 8:17this process, I was able to take a more
219. 8:19proactive role in my research and
220. 8:21engage in activities involving
221. 8:23deliberation and design. I would say
222. 8:26that these processes are very similar
223. 8:29to the duties I perform as a CD
224. 8:32engineer. Due to the nature of my role
225. 8:34at PSA, a significant portion involves
226. 8:36interpretation. While contemplating how
227. 8:39to approach this from a more diverse
228. 8:41perspective, I decided to build my
229. 8:43knowledge. Applied has a system that
230. 8:45actively supports tuition, allowing me
231. 8:48to grow by balancing my current work
232. 8:51with my studies. As a market-leading
233. 8:53company, Applied handles most of the
234. 8:56processes required for semiconductor
235. 8:58manufacturing. Because of its diverse
236. 9:00technological capabilities and long
237. 9:02history, it has the advantage of
238. 9:04possessing extensive research
239. 9:05facilities and a rich history compared
240. 9:07to other companies. Personally, I also
241. 9:10consider the atmosphere where team
242. 9:12members 'opinions are actively
243. 9:14incorporated to be one of Applied's
244. 9:15unique strengths. When I first joined,
245. 9:18I felt I lacked practical knowledge, as
246. 9:21school focused heavily on theoretical
247. 9:24subjects. While working in the C
248. 9:26department, I was able to learn the
249. 9:27operating principles of equipment,
250. 9:28communication methods, and electrical
251. 9:30structures necessary for the field. Now
252. 9:31, in my current role at PSA, I am
253. 9:34learning about public mechanisms and
254. 9:36customer device integration, and I feel
255. 9:39I am continuously growing. As I
256. 9:42mentioned earlier, there are many
257. 9:44challenging aspects to my work.
258. 9:46Therefore, I hope you take the time to
259. 9:48seriously consider whether this aligns
260. 9:50with what you want to do, and approach
261. 9:52this challenge with passion. The
262. 9:54process of preparing for employment may
263. 9:55not be easy, but I wish you the best of
264. 9:57luck, and I look forward to seeing you
265. 9:59at the company. Show me the best.