重大突破!中國新一代光刻機亮相上海進博會 國產率破90%ASML慌了參展六屆突缺席【#全球大爆卦】20261110@全球大視野Global_Vision — Transcript
Full transcript
- 0:00I have some breaking news to share: a
- 0:01major breakthrough. A Chinese
- 0:03lithography machine has entered two
- 0:04production lines, with a domestic
- 0:06localization rate exceeding 90%. Right,
- 0:08and it also made a stunning debut at the
- 0:10CIIE on this very day. Let's take a look
- 0:12; this new generation of Chinese
- 0:14lithography equipment was unveiled at
- 0:16the CIIE, which runs from November 5th
- 0:18to November 10th.
- 0:19Actually, just before we went live, a
- 0:21peer of mine in mainland China asked me
- 0:24, "Why didn't you come to the CIIE?"
- 0:26I actually really wanted to go, and I
- 0:28hope to have the opportunity to check it
- 0:30out in the future. Because at the CIIE,
- 0:32they always showcase some of their
- 0:34latest products to everyone.
- 0:36This time, Shanghai Micro Electronics
- 0:38Equipment (SMEE) showcased its
- 0:40self-developed new-generation front-end
- 0:42dry lithography machine and a scanner
- 0:44projection lithography model.
- 0:47There are two models in total, which
- 0:48we've found images of to show you.
- 0:52Furthermore, during this debut at the
- 0:54CIIE, SMEE also disclosed some
- 0:56information, including that China's
- 0:58current domestic localization rate has
- 1:00exceeded 90%, filling a gap in the
- 1:02domestic market.
- 1:06In addition, it is actually already in
- 1:08operation on production lines.
- 1:12They announced that it has supported the
- 1:14production of over 10 million wafers,
- 1:16with the effective operating rate of
- 1:17current domestic equipment exceeding 92
- 1:19%.
- 1:22Another point that has drawn much
- 1:24outside attention is that in such a
- 1:26large event, many international
- 1:27manufacturers have come to participate.
- 1:31For the past six years, ASML has
- 1:33attended, but having participated for
- 1:36six consecutive years since 2020, ASML
- 1:38is suddenly absent this year.
- 1:42I looked up the official reason; they
- 1:44stated that it conflicted with their
- 1:46company's internal global meetings.
- 1:50But they are absent, and you see, at the
- 1:52very moment they are absent, China
- 1:54unveiled two of its newest lithography
- 1:56machines.
- 1:57Let's ask Brother Daxian immediately:
- 1:59what does he think this move signifies?
- 2:02>> Right, I was also planning to attend the
- 2:05CIIE this time, but because of the
- 2:06elections in Taiwan, I had to come back
- 2:08to help with the campaign, so I couldn't
- 2:10make it to the CIIE.
- 2:13Let me give everyone a brief
- 2:14introduction: the lithography machines
- 2:17you hear about are divided into two
- 2:19types—one is called EUV, or extreme
- 2:21ultraviolet, and the other is called DUV
- 2:23, or deep ultraviolet.
- 2:27The difference between the two lies in
- 2:28the wavelength of the light source they
- 2:30excite; the narrower the wavelength of
- 2:32the light source, the more advanced the
- 2:34process you can perform, and the smaller
- 2:35you can make the chips.
- 2:39For Extreme Ultraviolet, known as EUV,
- 2:42the wavelength of the light excited from
- 2:44the tin droplets is approximately 13.5
- 2:46nanometers.
- 2:50Once you can achieve 13.5 nanometers,
- 2:53you have reached a very critical
- 2:54milestone in the progress of EUV
- 2:56technology.
- 2:59However, for DUV, which is called Deep
- 3:01Ultraviolet, the wavelength of the
- 3:03excited light is not as narrow as that
- 3:06of EUV, which is why DUV can only be
- 3:08used to manufacture chips with mature
- 3:10processes.
- 3:12That is the first piece of popular
- 3:14science I've shared with you.
- 3:16Secondly, we just heard Hui-lin mention
- 3:18"dry process." What is "dry process"?
- 3:21DUV can be divided into "dry" and what
- 3:24we call "wet" or "immersion" lithography
- 3:27.
- 3:28Where is the difference between the two
- 3:29?
- 3:32The difference lies in what is placed
- 3:34between the wafer—the wafer you are
- 3:36about to etch—and the objective lens
- 3:38below.
- 3:41If you simply place it there with air in
- 3:43between, that is called the dry process
- 3:45.
- 3:46But if you use pure water in between,
- 3:48specifically ultra-high-purity water,
- 3:50that is called the immersion process.
- 3:53Many people ask, what is the difference
- 3:55between dry and wet? It lies in the
- 3:57medium.
- 3:58If it is air, your refractive index is 1
- 4:01; if it is high-purity ultrapure water,
- 4:04your refractive index is 1.44.
- 4:09The higher the refractive index of the
- 4:11intermediate medium, the smaller the
- 4:13final size of the chip that can be
- 4:15produced.
- 4:19So, everyone can see that the chips
- 4:21produced by the wet process are
- 4:23relatively smaller because there is
- 4:25water in between, resulting in a higher
- 4:27refractive index; therefore, wet DUV can
- 4:29produce chips of approximately 28 to 38
- 4:31nanometers.
- 4:37As for the dry process, which I just
- 4:39mentioned has a lower refractive index,
- 4:41the chips it produces are generally 65
- 4:43nanometers or larger.
- 4:47Alright, now let’s turn back to SME,
- 4:49which is the Shanghai Micro Electronics
- 4:51Equipment Company; this company actually
- 4:53has three models.
- 4:56>> At this exhibition, everyone only
- 4:59noticed two models, the SSB800 and the
- 5:01SSC800.
- 5:03But in fact, there is also an SSA800
- 5:05model.
- 5:06The SSA800 model is what I am talking
- 5:08about; it is an immersion DUV. Yeah,
- 5:11>> Since it is immersion DUV, the chips it
- 5:13produces are smaller, at 28 nanometers.
- 5:15What we are currently saying about China
- 5:18being able to use 28nm multi-patterning
- 5:21starts here; its limit can reach 28nm,
- 5:23and this SSA800 has already entered
- 5:25production with a localization rate of
- 5:28over 85%.
- 5:31Now, the SB800 and SC800 you see are
- 5:33both dry DUVs, so the chips they produce
- 5:36are relatively larger, which are mature
- 5:38process chips.
- 5:42The SB800 uses i-line technology, so the
- 5:45wavelength of the light source it
- 5:47excites is about 365 nanometers.
- 5:50With a 365nm wavelength, the chip size
- 5:53it can produce is between about 250nm
- 5:56and 350nm, and the localization rate
- 5:58exceeds 90%.
- 5:59>> As for the SSC800, it uses KrF
- 6:02technology, so the light wavelength it
- 6:04excites is narrower, about 248
- 6:06nanometers, so the chip size it can
- 6:09produce is between about 110nm and 180nm
- 6:12, and the localization rate also exceeds
- 6:1590%. Many people always talk about
- 6:17multi-patterning when discussing this,
- 6:20saying they can use multi-patterning to
- 6:22turn 28nm into 7nm. Does everyone know
- 6:24what multi-patterning is?
- 6:26Let me give you an example:
- 6:28multi-patterning is like wanting to draw
- 6:30two very thin parallel lines on a wall,
- 6:32but you only have a very thick brush.
- 6:34What would you do?
- 6:37As you can see, DUV is like that thick
- 6:39brush because its light wavelength is
- 6:41too long and too wide, so their method
- 6:43is: you take that brush and paint a
- 6:45stroke on the wall first.
- 6:49After you paint one stroke, you apply a
- 6:51special substance to both sides, and
- 6:53then what do you do next?
- 6:56You dig out and etch away the middle
- 6:58part.
- 6:59Yeah,
- 6:59>> After you remove that, aren't you left
- 7:01with just two edge lines? You are left
- 7:04with two very narrow lines; this is what
- 7:06we call multi-patterning, explained in
- 7:08simple terms. So how is multi-patterning
- 7:10done? First, you need to perform an
- 7:12initial exposure, then move to the
- 7:13second step of deposition, which
- 7:15involves depositing material on both
- 7:17sides. Third, you need to etch, clearing
- 7:19out the center. Fourth, you need to
- 7:21deposit again, which requires another
- 7:22exposure. This is called
- 7:24multi-patterning. Repeatedly performing
- 7:26this multi-patterning lowers the yield
- 7:27each time, because getting the alignment
- 7:29right for these repeated exposures is
- 7:31not an easy task. So, the
- 7:33multi-patterning that Mainland China is
- 7:35currently capable of is what SMIC is
- 7:37doing for Huawei’s 7nm Kirin chips. Its
- 7:39yield is probably only around 50%. A 50
- 7:41%yield means the cost is double that of
- 7:44TSMC’s—it’s effectively two times higher
- 7:47. But for Mainland China, I believe they
- 7:49can afford it. The priority now is
- 7:51whether or not there are chips available
- 7:53; it’s no longer a question of yield.
- 7:56Therefore, in the short term, using this
- 7:58multi-patterning method—despite the low
- 8:00yield and high costs—is sufficient to
- 8:02meet their current demands.
- 8:05So, what will we see next? It is the
- 8:0713.5 nm extreme ultraviolet light I
- 8:09mentioned, which has actually been
- 8:11developed by domestic companies in
- 8:13Mainland China. So, when it comes to the
- 8:15mass production of EUV lithography
- 8:17machines, I think it will happen within
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